Realme is ready to launch a new smartphone under its X series. Rumor has it that the device is called Realme X9 and not Realme X7. One of the company’s teasers suggests that the alleged Realme X9 series will feature a dazzling glass back panel, similar to the Realme V15 and X7 Pro smartphones.
GSMArena claims that the Pro version of the same device is powered by the MediaTek Dimensity 1200 processor. This is a flagship MediaTek chipset based on a 6nm process.
CEO brand Madhav Sheth confirmed on Twitter that the upcoming Realme X-series phone will feature this MediaTek SoC. A few days ago, the manager shared a picture of the alleged Realme X9 smartphone, which shows that the Realme logo “Dare to Leap” is attached to the back. The device will likely also have a speaker grille, USB Type-C port, and microphone on the bottom. However, according to the teaser, there may not be a 3.5mm headphone jack.
Previously, the phone was believed to be the Realme X7 Pro smartphone, which is already available in China. A support page for the Realme X7 Pro was recently discovered on the Realme India official website. This suggests that the company may have plans to launch two different X-series phones. The Realme X7 series may offer mid-range specs and the X9 series could start with high-end specs as suggested by teasers.
Realme is expected to announce the name of the phone soon, which will clear the confusion. If leaks and rumors are suspected, the Realme X9 Pro could have a 108-megapixel camera that could also be supported by two 13-megapixel camera modules.
GSMArena also reported that the flagship phone could arrive with a 6.4-inch OLED display with a refresh rate of 120 Hz and a resolution of 1080 x 2400 pixels. It could offer a 4,500 mAh battery with support for 65 W fast charge. Also, Realme has plans to launch a Snapdragon 888-enabled phone, according to the named source. This is the same 5nm chip that will power most flagship phones in 2021.
